Published June 17, 1983 | Version v1
Journal article

TiN as a diffusion barrier between CoSi2 or PtSi and aluminum

Creators

  • 1. Bell Labs., Murray Hill, NJ (USA)

Description

The effectiveness of a thin (360 A) layer of reactively sputtered TiN as a diffusion barrier between aluminum and two silicides (PtSi and CoSi2) was evaluated. The chemical composition, structural phases and electrical properties of silicide/Al and silicide/TiN/Al contacts to n-type silicon were studied by Rutherford backscattering spectroscopy, glancing angle X-ray diffraction and Schottky barrier height measurements respectively. The results show that TiN is an effective barrier in these two systems up to at least 4500C, the typical temperature at which aluminum contacts are sintered. (Auth.)

Additional details

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
104
Journal Issue
1-2
Series
Thin Solid Films.
Journal Page Range
89-99
ISSN
0040-6090

Conference

Title
Symposium on interfaces and contacts.
Dates
2-4 Nov 1982.
Place
Boston, MA (USA).