Published May 14, 1988 | Version v1
Patent

Heat receiving plates in thermonuclear device

Description

Purpose: To obtain a heat receiving plate structure capable of withstanding sputtering wear and retaining the thermal deformation and residual stress low upon junction and available at a reduced cost. Constitution: Junction structures between heat sinks and armours are the same as usual, whereas high melting armour (for example, made of tungsten) are used at the portion on a heat receiving plate where the thermal load and particle load are higher while materials having a heat expansion coefficient similar to that of the heat sink (stainless steel) are used at the portion where the thermal load and particle load are lower on a heat receiving plate depending on the thermal load and particle load distribution. This can reduce the thermal deformation for the entire divertor heat receiving plate to obtain a heat receiving plate of a good surface dimensional accuracy. (Takahashi, M.)

Availability note (English)

Available from JAPIO. Also available from INPADOC.

Additional details

Publishing Information

Imprint Pagination
4 p.
IPC:
Int. Cl. G21B1/00.
IPC
Int. Cl. G21B1/00.
Patent number
JP patent document 63-109391/A/

Optional Information

Secondary number(s)
JP patent application 61-254735.