Published December 2, 2013 | Version v1
Journal article

Influence of growth temperature and temperature ramps on deep level defect incorporation in m-plane GaN

  • 1. Sandia National Laboratories, Albuquerque, New Mexico 87185 (United States)
  • 2. Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106 (United States)
  • 3. Materials Department, University of California, Santa Barbara, California 93106 (United States)

Description

The dependence of deep level defect incorporation in m-plane GaN films grown by metal-organic chemical vapor deposition on bulk m-plane GaN substrates as a function of growth temperature (Tg) and Tg ramping method was investigated using deep level optical spectroscopy. Understanding the influence of Tg on GaN deep level incorporation is important for InGaN/GaN multi-quantum well (MQW) light emitting diodes (LEDs) and laser diodes (LDs) because GaN quantum barrier (QB) layers are grown much colder than thin film GaN to accommodate InGaN QW growth. Deep level spectra of low Tg (800 °C) GaN films grown under QB conditions were compared to deep level spectra of high Tg (1150 °C) GaN. Reducing Tg, increased the defect density significantly (>50×) through introduction of emergent deep level defects at 2.09 eV and 2.9 eV below the conduction band minimum. However, optimizing growth conditions during the temperature ramp when transitioning from high to low Tg substantially reduced the density of these emergent deep levels by approximately 40%. The results suggest that it is important to consider the potential for non-radiative recombination in QBs of LED or LD active regions, and tailoring the transition from high Tg GaN growth to active layer growth can mitigate such non-radiative channels

Additional details

Identifiers

Publishing Information

Journal Title
Applied Physics Letters
Journal Volume
103
Journal Issue
23
Journal Page Range
p. 232108-232108.4
ISSN
0003-6951
CODEN
APPLAB

Optional Information

Notes
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