Distribution of coating thickness applied by magnetron sputtering

The Danilin model for flat ring evaporator was studied and used to calculate the thickness distribution of the coating. The calculations for different types of the cathode current density variations (uniform, triangle and third-degree polynomial) were made. Relation between the magnetron sputtering system parameters providing the most uniform coating was analysed. Research of the target sputtering profile with nonzero cone angle was performed. It was established that in case of the cone angle increasing in the areas of substrate situated under the cathode the sputtered coating becomes thicker. Also at the center and on the edges of the substrate the coating thickness is decreased due to the redistribution of thickness. (paper)