Published September 16, 1994 | Version v1
Patent Metadata-only

Cooling pipe

Creators

Description

A cooling pipe disposed to a high temperature heat receiving plate has a double wall structure, and the pressure is increased in the inner pipe than the outer pipe, as well as holes are perforated to a portion of the inner pipe so that cooling water is jetted out from the holes to a portion where a thermal load is exerted. This can remove heat of the inner pipe of the cooling pipe more effectively than a swirling flow, as well as film boiling on the wall surface can be suppressed. In addition, since low temperature cooling water is brought into contact with the portion where the thermal load is exerted, thermal load resistance is improved. (T.M.)

Availability note (English)

Available from JAPIO. Also available from EPO.

Additional details

Publishing Information

Imprint Pagination
5 p.
IPC:
Int. Cl. G21B1/00.
IPC
Int. Cl. G21B1/00.
Patent number
JP patent document 6-258467/A/

INIS

Country of Publication
Japan
Country of Input or Organization
Japan
INIS RN
26043701
Subject category
S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
Resource subtype / Literary indicator
Non-conventional Literature
Descriptors DEI
COOLING; FILM BOILING; HEATING; MAGNETIC FIELDS; PIPES; PLASMA; THERMAL EFFICIENCY; THERMONUCLEAR REACTOR COOLING SYSTEMS; TOKAMAK DEVICES; VORTEX FLOW
Descriptors DEC
BOILING; CLOSED PLASMA DEVICES; COOLING SYSTEMS; EFFICIENCY; FLUID FLOW; PHASE TRANSFORMATIONS; THERMONUCLEAR DEVICES

Optional Information

Secondary number(s)
JP patent application 5-44021.