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Published March 2020 | Version v1
Journal article

Effect of double doping, Li and Se, on the high-temperature thermoelectric properties of Cu2Te

  • 1. Karlsruhe Institute of Technology. Light Technology Institute (Germany)
  • 2. Indian Institute of Technology Bombay. Department of Metallurgical Engineering and Materials Science (India)

Description

Cuprous chalcogenide, Cu2Se, attracted attention due to its large Seebeck coefficient coupled with low thermal conductivity, facilitated by the presence of disordered Cu-ions in the structure of Cu–Se. This compound is thermally unstable prompting investigation of its analogue Cu2Te which has a lower figure-of-merit zT due to its high charge carrier concentration. In the present work, a dual substitution, both cation and anion by Li and Se, respectively, has been attempted to enhance zT. The Cu2−xLixTe1−ySey alloys have been synthesized by a simple, conventional arc melting process and investigated without subjecting to any further processing. The room temperature microstructure shows a plate-like layered nanostructure in the grains with the grains oriented in random directions. The alloys at room temperature have two polymorphic phases, superstructured hexagonal and orthorhombic, co-existing in all the alloys. The alloys exhibit a degenerate semiconducting behavior in the range 300–1000 K with the conductivity decreasing from ~ 3000 Scm−1 to 700 Scm−1. All the alloys show a hole dominant Seebeck coefficient which increases with temperature from ~ 30 to 135 μVK−1. The alloy with dual substitution, Li-0.1 and Se-0.03, has the highest power factor of 1.6 mWm−1 K−2 at 1000 K. It's low thermal conductivity in the complete range < 1.5 Wm−1 K−1 results in increasing the zT to 1.0 at 1000 K, an increase of 130% compared to the undoped alloy. These alloys are found to be thermally and temporally stable with no significant power loss either due to thermal cycling or aging.

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Publishing Information

Journal Title
Journal of Materials Science. Materials in Electronics
Journal Volume
31
Journal Issue
5
Journal Page Range
p. 4129-4134
ISSN
0957-4522
CODEN
JSMEEV

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Copyright (c) 2020 © Springer Science+Business Media, LLC, part of Springer Nature 2020