Published December 1, 2019
| Version v1
Journal article
Simulation of Temperature Field in FDM Process
- 1. Projecting Equipment Support Department, Army Military Transportation University, Tianjin 300161 (China)
- 2. Fifth Team of Cadets, Army Military Transportation University, Tianjin 300161 (China)
Description
In order to improve the precision and mechanical properties of FDM molding parts, the temperature field of the rectangular thin block was simulated and studied by using the finite element method. The analysis results were consistent with the actual process. On this basis, the temperature field distribution of the molded parts under different printing speeds was compared, providing guidance for the reasonable selection of printing speeds. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/1757-899X/677/3/032080Additional details
Identifiers
Publishing Information
- Journal Title
- IOP Conference Series. Materials Science and Engineering (Online)
- Journal Volume
- 677
- Journal Issue
- 3
- Journal Page Range
- [5 p.]
- ISSN
- 1757-899X
Conference
- Title
- 4. International Conference on Insulating Materials, Material Application and Electrical Engineering
- Dates
- 12-13 Oct 2019
- Place
- Melbourne (Australia)
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 54077752
- Subject category
- S42: ENGINEERING;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ACCURACY; COMPUTERIZED SIMULATION; FINITE ELEMENT METHOD; MECHANICAL PROPERTIES; MOLDING
- Descriptors DEC
- CALCULATION METHODS; FABRICATION; MATHEMATICAL SOLUTIONS; NUMERICAL SOLUTION; SIMULATION