Published July 20, 2004 | Version v1
Journal article

Athermal annealing of semiconductors using shock waves generated by a laser-plasma

  • 1. Plasma Physics Division, Naval Research Laboratory, Washington DC 20375 (United States)
  • 2. Materials Science and Technology Division, Naval Research Laboratory, Washington DC 20375 (United States)
  • 3. Southwest Texas State University, San Marcos TX 78666 (United States)

Description

We are investigating an annealing technique in which shock or sound waves generated by a laser-plasma are used to anneal a semiconductor. The athermal annealing (AA) process occurs very rapidly, which results in almost no diffusion of. dopants. A HeNe laser is used to measure the reflectivity of the silicon as a function of time. Measurements show that the annealing occurs in 1.8 μsec, which is the acoustic time scale for waves to propagate from the focus through the AA region. A knife-edge technique is employed to study acoustic waves in the sample by measuring the deflection of the probe beam. Initial results for aluminum samples irradiated at modest laser intensities (200 mJ, 50 nsec) show well-defined surface acoustic waves. However, both silicon and GaAs have more complicated structure which resemble Lamb (plate) waves

Additional details

Identifiers

Publishing Information

Journal Title
AIP Conference Proceedings
Journal Volume
706
Journal Issue
1
Journal Page Range
p. 1381-1384
ISSN
0094-243X
CODEN
APCPCS

Conference

Title
American Physical Society Topical Group conference on shock compression of condensed matter
Dates
20-25 Jul 2003
Place
Portland, OR (United States)

Optional Information

Notes
(c) 2004 American Institute of Physics