Published January 2011 | Version v1
Journal article

Combined quantitative ultrasonic and time-resolved interaction force AFM imaging

  • 1. G. W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332 (United States)

Description

The authors describe a method where quantitative ultrasonic atomic force microscopy (UAFM) is achieved during time-resolved interaction force (TRIF) imaging in intermittent contact mode. The method uses a calibration procedure for quantitative UAFM. It improves elasticity measurements of stiff regions of surfaces while retaining the capabilities of the TRIF mode for topography, adhesion, dissipation, and elasticity measurements on soft regions of sample surfaces. This combination is especially advantageous when measuring and imaging samples with broad stiffness range in a nondestructive manner. The experiments utilize an active AFM probe with high bandwidth and the UAFM calibration is performed by measuring the magnitude of the time-resolved UAFM signal at a judiciously chosen frequency for different contact stiffness values during individual taps. Improved sensitivity to stiff surface elasticity is demonstrated on a special sample. The results show that combining UAFM with TRIF provides 2.5 GPa (5%) standard deviation on the silicon surface reduced Young's modulus, representing 5x improvement over using only TRIF mode imaging.

Additional details

Identifiers

Publishing Information

Journal Title
Review of Scientific Instruments
Journal Volume
82
Journal Issue
1
Journal Page Range
p. 013703-013703.4
ISSN
0034-6748
CODEN
RSINAK

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
44021419
Subject category
S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY; S42: ENGINEERING;
Descriptors DEI
ATOMIC FORCE MICROSCOPY; CALIBRATION; ELASTICITY; PRESSURE RANGE GIGA PA; SENSITIVITY; SIGNALS; SILICON; SURFACES; TIME RESOLUTION; YOUNG MODULUS
Descriptors DEC
ELEMENTS; MECHANICAL PROPERTIES; MICROSCOPY; PRESSURE RANGE; RESOLUTION; SEMIMETALS; TIMING PROPERTIES

Optional Information

Notes
(c) 2011 American Institute of Physics