Published December 31, 2015 | Version v1
Journal article

Transparent conductive zinc-oxide-based films grown at low temperature by mist chemical vapor deposition

  • 1. New Energy and Environmental Business Division, Toshiba Mitsubishi-Electric Industrial Systems Corporation, Kobe International Business Center (KIBC) 509, 5-5-2 Minatojima-Minami, Chuo-Ku, Kobe 650-0047 (Japan)
  • 2. School of Systems Engineering, Kochi University of Technology, Kami, Kochi 780-8502 (Japan)
  • 3. Research Institute, Kochi University of Technology, Kami, Kochi 780-8502 (Japan)
  • 4. Photonics and Electronics Science and Engineering Center, Kyoto University, Katsura, Nishikyo-ku, Kyoto 615-8520 (Japan)

Description

Atmospheric pressure mist chemical vapor deposition (Mist–CVD) systems have been developed to grow zinc-oxide-based (ZnO-based) transparent conductive oxide (TCO) films. Low-resistive aluminum-doped ZnO (AZO) TCOs, showing resistivity of the order on 10−4 Ωcm, previously were grown using a safe source material zinc acetate [Zn(ac)2], at a growth temperature as high as 500 °C. To grow superior TCOs at lower temperatures, we proposed the addition of NH3 to accelerate the reaction of acetylacetonate compounds. As the result, we could grow gallium-doped ZnO (GZO) TCOs with a resistivity of 2.7 × 10−3 Ω cm and transmittance higher than 90% at 300 °C by using zinc acetylacetonate [Zn(acac)2] as the Zn source. To grow boron-doped ZnO (BZO) TCOs at a lower growth temperature of 200 °C, we used boron doping along with a toluene solution of diethylzinc (DEZ), that maintained high reactivity without being flammable. These BZO TCOs showed a resistivity of 1.5 × 10−3 Ω cm and transmittance higher than 90%, despite the use of a non-vacuum-based open-air technology. - Highlights: • Introduction of Mist–CVD as a non-vacuum-based, safe, and cost-effective growth technology • Process evolution of the growth technology to lower the growth temperature. • Achievement of low resistive ZnO films at 200oC.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2015.11.006

Additional details

Identifiers

DOI
10.1016/j.tsf.2015.11.006;
PII
S0040-6090(15)01098-6;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
597
Journal Page Range
p. 30-38
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.