Published January 2010 | Version v1
Journal article

Modeling of heat deposition on the W/Cu movable limiter in HT-7

  • 1. Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, Anhui 230031 (China)
  • 2. University of Science and Technology of China, Hefei, Anhui 230031 (China)
  • 3. Redmond Plasma Physics Laboratory, University of Washington, Seattle, WA 98195 (United States)

Description

The thermal behavior of a directly water-cooled W/Cu movable poloidal limiter was investigated in HT-7, a medium-sized superconducting tokamak with limiter configuration, major radius R = 1.22 m, and minor radius a = 0.27 m. The W/Cu movable limiter (ML) was exposed to the plasma at various radial positions at r < a. The surface and bulk temperatures were monitored by an IR-camera and the thermocouples, respectively. The heat flux deposited on the limiter was evaluated by an ANSYS code using the measured surface temperatures as boundary conditions. It was found that the maximum heat flux incident on the ML was less than 1 MW/m2 in the Ohmic discharges, but reached up to 5-7 MW/m2 in the discharges with lower hybrid current drive (LHCD). A simple model was developed to understand heat transport to the W/Cu ML, taking into account the 'funnel effect'.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.fusengdes.2009.08.006

Additional details

Identifiers

DOI
10.1016/j.fusengdes.2009.08.006;
PII
S0920-3796(09)00257-9;

Publishing Information

Journal Title
Fusion Engineering and Design
Journal Volume
85
Journal Issue
1
Journal Page Range
p. 126-129
ISSN
0920-3796
CODEN
FEDEEE

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
41069276
Subject category
S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
Descriptors DEI
DEPOSITION; HEAT FLUX; HEAT TRANSFER; HT-7 TOKAMAK; LIMITERS; LOWER HYBRID CURRENT DRIVE; SIMULATION
Descriptors DEC
CLOSED PLASMA DEVICES; ENERGY TRANSFER; NON-INDUCTIVE CURRENT DRIVE; THERMONUCLEAR DEVICES; TOKAMAK DEVICES

Optional Information

Copyright
Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.