Modeling of heat deposition on the W/Cu movable limiter in HT-7
- 1. Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, Anhui 230031 (China)
- 2. University of Science and Technology of China, Hefei, Anhui 230031 (China)
- 3. Redmond Plasma Physics Laboratory, University of Washington, Seattle, WA 98195 (United States)
Description
The thermal behavior of a directly water-cooled W/Cu movable poloidal limiter was investigated in HT-7, a medium-sized superconducting tokamak with limiter configuration, major radius R = 1.22 m, and minor radius a = 0.27 m. The W/Cu movable limiter (ML) was exposed to the plasma at various radial positions at r < a. The surface and bulk temperatures were monitored by an IR-camera and the thermocouples, respectively. The heat flux deposited on the limiter was evaluated by an ANSYS code using the measured surface temperatures as boundary conditions. It was found that the maximum heat flux incident on the ML was less than 1 MW/m2 in the Ohmic discharges, but reached up to 5-7 MW/m2 in the discharges with lower hybrid current drive (LHCD). A simple model was developed to understand heat transport to the W/Cu ML, taking into account the 'funnel effect'.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.fusengdes.2009.08.006Additional details
Identifiers
- DOI
- 10.1016/j.fusengdes.2009.08.006;
- PII
- S0920-3796(09)00257-9;
Publishing Information
- Journal Title
- Fusion Engineering and Design
- Journal Volume
- 85
- Journal Issue
- 1
- Journal Page Range
- p. 126-129
- ISSN
- 0920-3796
- CODEN
- FEDEEE
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 41069276
- Subject category
- S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
- Descriptors DEI
- DEPOSITION; HEAT FLUX; HEAT TRANSFER; HT-7 TOKAMAK; LIMITERS; LOWER HYBRID CURRENT DRIVE; SIMULATION
- Descriptors DEC
- CLOSED PLASMA DEVICES; ENERGY TRANSFER; NON-INDUCTIVE CURRENT DRIVE; THERMONUCLEAR DEVICES; TOKAMAK DEVICES
Optional Information
- Copyright
- Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.