Dynamic fracture analysis for 2D multilayered glass structures considering interlayer effects
Creators
- 1. Kunsan National University, Department of Naval Architecture and Ocean Engineering (Korea, Republic of)
Description
In this paper, we discuss the efficient peridynamic analysis for dynamic fracturing multilayered structures. Peridynamics is an effective computational method for dealing with cracks and damages in solid mechanics. However, its computational cost limits its applications, especially for multilayered structures laminated by relatively thick plies and thin interlayers. We introduce an implicit modeling scheme in which the interlayer is modeled by peridynamic ghost particles with proper nonlocal interactions while the ply is done by actual particles. The efficiency and accuracy of this nonlocal ghost interlayer are evaluated. We also investigate various characteristics of dynamic fracture correlated to interlayer effects and elastic backings. The interlayer plays many important roles in the dynamic fracturing of whole structures because it binds adjacent plies and restrains their motion. Through the peridynamic dynamic fracture analysis of 2D multilayered structures, we can conclude that the elastic deformation of interlayer and energy transferring between layers through interlayer have a considerable effect on fracture patterns of multilayered structures. This was confirmed by investigating propagations and interactions of strain energy.
Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Mechanical Science and Technology
- Journal Volume
- 33
- Journal Issue
- 8
- Journal Page Range
- p. 3641-3648
- ISSN
- 1738-494X
INIS
- Country of Publication
- Korea, Republic of
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 54085544
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- COMPUTERIZED SIMULATION; ELASTICITY; FRACTURING; GLASS; MECHANICS; PARTICLES; SOLIDS
- Descriptors DEC
- MECHANICAL PROPERTIES; SIMULATION
Optional Information
- Copyright
- Copyright (c) 2019 KSME & Springer