Solubility limit and annealing effects on the microstructure & thermoelectric properties of Fe 2 V 1 − x Ta x Al 1 − y Si y Heusler compounds
Creators
- 1. Institute of Solid State Physics, Technische Universität WienWiedner Hauptstraße 8-10, Vienna 1040 (Austria)
- 2. Christian Doppler Laboratory for Thermoelectricity, Technische Universität Wien, Wiedner Hauptstraße 8-10, Vienna 1040 (Austria)
- 3. Department of Advanced Materials Science, The University of Tokyo, Kashiwanoha 5-1-5, Kashiwa, Chiba 277-8561 (Japan)
- 4. International Center for Materials Nanoarchitectonics (WPI-MANA), National Institute for Materials Science (NIMS), Namiki 1-1, Tsukuba, Ibaraki 305-0044 (Japan)
Description
Full-Heusler compounds with the composition have recently shown to exhibit some of the highest thermoelectric power factors reported so far among bulk materials due to the band convergence and band gap opening caused by the V/Ta substitution. Therefore, the solubility limit of Ta and Si regarding the stability of the L2 phase is investigated in this study. The crystal structure and microstructure of a large number of samples is probed by X-ray diffraction as well as scanning electron microscopy and energy dispersive X-ray analysis. The results show that the Al/Si substitution significantly hampers the solubility of Ta within the Heusler structure. Furthermore, and reveal nanoscale impurity precipitates in the microstructure, together with diffuse contrasts that indicate a non-equilibrium metastable state. For that reason, different annealing conditions, varying temperature and time, have been applied to the latter and the effect on the microstructure and thermoelectric properties is investigated. It is found that additional annealing leads to further phase segregation and grain growth of the impurity precipitates, which have a detrimental effect on the Seebeck coefficient due to their metallic-like nature. They can, however, effectively reduce the lattice thermal conductivity if their average size remains below the phonon mean free path. The thermoelectric efficiency in terms of the dimensionless figure of merit is increased up to –0.34 at 300 K which is beyond the values previously reported for -based bulk materials.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.actamat.2021.116867Additional details
Identifiers
- DOI
- 10.1016/j.actamat.2021.116867;
- PII
- S1359645421002470;
Publishing Information
- Journal Title
- Acta Materialia
- Journal Volume
- 212
- Journal Page Range
- vp.
- ISSN
- 1359-6454
- CODEN
- ACMAFD
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 54079846
- Subject category
- S36: MATERIALS SCIENCE; S77: NANOSCIENCE AND NANOTECHNOLOGY;
- Descriptors DEI
- CRYSTAL STRUCTURE; GRAIN GROWTH; MEAN FREE PATH; METASTABLE STATES; MICROSTRUCTURE; NANOSTRUCTURES; PERFORMANCE; PHONONS; POWER FACTOR; PRECIPITATION; SCANNING ELECTRON MICROSCOPY; SOLUBILITY; THERMAL CONDUCTIVITY; THERMOELECTRIC PROPERTIES; THERMOELECTRICITY; X RADIATION; X-RAY DIFFRACTION
- Descriptors DEC
- COHERENT SCATTERING; DIFFRACTION; DIMENSIONLESS NUMBERS; ELECTRICAL PROPERTIES; ELECTRICITY; ELECTROMAGNETIC RADIATION; ELECTRON MICROSCOPY; ENERGY LEVELS; EXCITED STATES; IONIZING RADIATIONS; MICROSCOPY; PHYSICAL PROPERTIES; QUASI PARTICLES; RADIATIONS; SCATTERING; SEPARATION PROCESSES; THERMODYNAMIC PROPERTIES
Optional Information
- Copyright
- Copyright (c) 2021 The Author(s). Published by Elsevier Ltd on behalf of Acta Materialia Inc.