Evolution of surface stress during oxygen exposure of clean Si(111), Si(100), and amorphous Si surfaces
- 1. Max Planck Institute for Intelligent Systems (formerly Max Planck Institute for Metals Research), Heisenbergstraße 3, D-70569 Stuttgart (Germany)
- 2. Institute for Materials Science, University of Stuttgart, D-70569 Stuttgart (Germany)
Description
The evolutions of the surface stress of Si(111)-7 × 7, Si(100)-2 × 1, and a-Si surfaces upon oxygen exposure at pO2 = 1 × 10−4 Pa and room temperature have been investigated in a comparative manner using a specimen-curvature based technique. To this end, a generally applicable, dedicated set of experiments has been devised and performed to deduce and correct for the surface stress change owing to oxygen reaction(s) at the (poorly-defined) back face of the specimen only. On this basis, it could be demonstrated that exposure of clean Si(111)-7 × 7, Si(100)-2 × 1 and a-Si surfaces to pure oxygen gas results in compressive surface stress changes for all three surfaces due to the incorporation of oxygen into Si backbonds. The measured surface stress change decreases with decreasing atomic packing density at the clean Si surfaces, which complies well with the less-densily packed Si surface regions containing more free volume for the accommodation of adsorbed O atoms
Additional details
Identifiers
- DOI
- 10.1063/1.4850936;
Publishing Information
- Journal Title
- Journal of Applied Physics
- Journal Volume
- 115
- Journal Issue
- 2
- Journal Page Range
- p. 023501-023501.6
- ISSN
- 0021-8979
- CODEN
- JAPIAU
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 45092504
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- ADSORPTION; ATOMS; CRYSTAL STRUCTURE; DENSITY; OXYGEN; SILICON; STRESSES; SURFACES; TEMPERATURE RANGE 0273-0400 K
- Descriptors DEC
- ELEMENTS; NONMETALS; PHYSICAL PROPERTIES; SEMIMETALS; SORPTION; TEMPERATURE RANGE
Optional Information
- Notes
- (c) 2014 AIP Publishing LLC