Comparison of experimental target currents with analytical model results for plasma immersion ion implantation

Ion implantation is a standard fabrication technique used in semiconductor manufacturing. Implantation has also been used to modify the surface properties of materials to improve their resistance to wear, corrosion and fatigue. However, conventional ion implanters require complex optics to scan a narrow ion beam across the target to achieve implantation uniformity. An alternative implantation technique, called Plasma Immersion Ion Implantation (PIII), immerses the target into a plasma. The ions are extracted from the plasma directly and accelerated by applying negative high-voltage pulses to the target. An analytical model of the voltage and current characteristics of a remote plasma is presented. The model simulates the ion, electron and secondary electron currents induced before, during and after a high voltage negative pulse is applied to a target immersed in a plasma. The model also includes analytical relations that describe the sheath expansion and collapse due to negative high voltage pulses. The sheath collapse is found to be important for high repetition rate pulses. Good correlation is shown between the model and experiment for a wide variety of voltage pulses and plasma conditions