EB curable solutions for flexible packaging

Flexible packaging markets have recently become the most ambitious targets of the energy curable development efforts. The new low voltage and lower cost electron beam systems provide the enabling technology for this expansion. EB curing opens up new possibilities in addressing some key needs of the flexible packaging converting. Several constructions of the flexible packaging materials representing various EB curing applications, including EB flexo inks, coatings and adhesives will be discussed. These applications have a potential to reduce cycle times and cost. The challenge is to match the existing functional/structural properties of the package. (author)