Published April 15, 2019
| Version v1
Journal article
Electrochemical migration failure mechanism and dendrite composition characteristics of Sn96.5Ag3.0Cu0.5 alloy in thin electrolyte films
- 1. University of Science and Technology Beijing, Beijing Advanced Innovation Center for Materials Genome Engineering, Key Laboratory for Corrosion and Protection (MOE) (China)
Description
The effects of chloride ions on electrochemical migration (ECM) of Sn96.5Ag3.0Cu0.5 (SAC 305) solder alloy are studied through in situ electrochemical observation device and ex situ transmission electron microscope (TEM) and X-ray photoelectron spectroscopy (XPS) techniques. The results show that the time to short circuit is the longest at intermediate NaCl concentration, which is related to the precipitates between two electrodes. The composition of dendrite inspected by TEM-EDS and XPS techniques shows that dendrites do not contain elements Ag and Cu, which suggests that Sn is the only migration element in SAC 305 alloy.
Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Materials Science. Materials in Electronics
- Journal Volume
- 30
- Journal Issue
- 7
- Journal Page Range
- p. 6575-6582
- ISSN
- 0957-4522
- CODEN
- JSMEEV
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 52019384
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- CHLORINE IONS; COPPER; CRYSTAL LATTICES; DENDRITES; ELECTROCHEMISTRY; MIGRATION; SILVER; SODIUM CHLORIDES; TELLURIUM ALLOYS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X-RAY PHOTOELECTRON SPECTROSCOPY
- Descriptors DEC
- ALKALI METAL COMPOUNDS; ALLOYS; CHARGED PARTICLES; CHEMISTRY; CHLORIDES; CHLORINE COMPOUNDS; CRYSTAL STRUCTURE; CRYSTALS; ELECTRON MICROSCOPY; ELECTRON SPECTROSCOPY; ELEMENTS; FILMS; HALIDES; HALOGEN COMPOUNDS; IONS; METALS; MICROSCOPY; PHOTOELECTRON SPECTROSCOPY; SODIUM COMPOUNDS; SODIUM HALIDES; SPECTROSCOPY; TRANSITION ELEMENTS
Optional Information
- Copyright
- Copyright (c) 2019 Springer Science+Business Media, LLC, part of Springer Nature