Published April 15, 2019 | Version v1
Journal article

Electrochemical migration failure mechanism and dendrite composition characteristics of Sn96.5Ag3.0Cu0.5 alloy in thin electrolyte films

  • 1. University of Science and Technology Beijing, Beijing Advanced Innovation Center for Materials Genome Engineering, Key Laboratory for Corrosion and Protection (MOE) (China)

Description

The effects of chloride ions on electrochemical migration (ECM) of Sn96.5Ag3.0Cu0.5 (SAC 305) solder alloy are studied through in situ electrochemical observation device and ex situ transmission electron microscope (TEM) and X-ray photoelectron spectroscopy (XPS) techniques. The results show that the time to short circuit is the longest at intermediate NaCl concentration, which is related to the precipitates between two electrodes. The composition of dendrite inspected by TEM-EDS and XPS techniques shows that dendrites do not contain elements Ag and Cu, which suggests that Sn is the only migration element in SAC 305 alloy.

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Identifiers

Publishing Information

Journal Title
Journal of Materials Science. Materials in Electronics
Journal Volume
30
Journal Issue
7
Journal Page Range
p. 6575-6582
ISSN
0957-4522
CODEN
JSMEEV

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Copyright (c) 2019 Springer Science+Business Media, LLC, part of Springer Nature