Published February 15, 2005 | Version v1
Journal article

Microstructure evolution of electroless Ni-B film during its depositing process

  • 1. Instrumental Analysis Center, Shanghai Jiaotong University, Shanghai 200030 (China)
  • 2. School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai 200030 (China)
  • 3. Engineering Practical Training Center, Shanghai University of Engineering Science, Shanghai 200336 (China)

Description

An electroless Ni-B film was deposited in natural state of the plating bath. The structure and composition distribution in depth of the film were explored by X-ray diffraction (XRD) and Auger electron spectroscopy (AES) after the deposition. It was found that the film experienced morphologic transformations during the deposition. The morphology of the film varied in-step with its structure and was presumably relevant with the changes of depositing rate. The mechanism that leads to the morphologic transformations has been discussed

Additional details

Identifiers

DOI
10.1016/j.apsusc.2004.07.059;
PII
S0169-4332(04)01179-1;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
240
Journal Issue
1-4
Journal Page Range
p. 28-33
ISSN
0169-4332
CODEN
ASUSEE

Optional Information

Copyright
Copyright (c) 2004 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.