Published February 15, 2005
| Version v1
Journal article
Microstructure evolution of electroless Ni-B film during its depositing process
- 1. Instrumental Analysis Center, Shanghai Jiaotong University, Shanghai 200030 (China)
- 2. School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai 200030 (China)
- 3. Engineering Practical Training Center, Shanghai University of Engineering Science, Shanghai 200336 (China)
Description
An electroless Ni-B film was deposited in natural state of the plating bath. The structure and composition distribution in depth of the film were explored by X-ray diffraction (XRD) and Auger electron spectroscopy (AES) after the deposition. It was found that the film experienced morphologic transformations during the deposition. The morphology of the film varied in-step with its structure and was presumably relevant with the changes of depositing rate. The mechanism that leads to the morphologic transformations has been discussed
Additional details
Identifiers
- DOI
- 10.1016/j.apsusc.2004.07.059;
- PII
- S0169-4332(04)01179-1;
Publishing Information
- Journal Title
- Applied Surface Science
- Journal Volume
- 240
- Journal Issue
- 1-4
- Journal Page Range
- p. 28-33
- ISSN
- 0169-4332
- CODEN
- ASUSEE
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 38060475
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- AUGER ELECTRON SPECTROSCOPY; BORON ALLOYS; DEPOSITS; EVOLUTION; FILMS; MICROSTRUCTURE; MORPHOLOGY; NICKEL ALLOYS; PLATING; X-RAY DIFFRACTION
- Descriptors DEC
- ALLOYS; COHERENT SCATTERING; DEPOSITION; DIFFRACTION; ELECTRON SPECTROSCOPY; SCATTERING; SPECTROSCOPY; SURFACE COATING; TRANSITION ELEMENT ALLOYS
Optional Information
- Copyright
- Copyright (c) 2004 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.