Published April 1, 2016 | Version v1
Journal article

The influence of nanoadditives on the tribological properties of process fluids

  • 1. Institute for Nanomaterials, Advanced Technology and Innovation, Technical University of Liberec, Studentska 2, 461 17 (Czech Republic)

Description

Tribology deals with interaction of surfaces in relative motion depending on their design, friction, wear and lubrication. The proper use of process fluids or lubricants can bring a significant reduction in friction and the amount of wear, thereby leading to a reduction in power consumption. During different technological operations contamination of used process fluids or lubricants occurs. Such contamination leads not only to a reduction of the lifetime of the lubricants but it can also change the functional properties and increase the health risks for operators. The quality of the process fluid is among other things influenced by bacterial attacks. The use of nanoadditives is one method for inhibiting the bacteria and improving the bioavailability and stability of the technological fluids. Nanolubricant is a new system composed of nanometer-sized particles dispersed in a base lubricant. The doping of lubricants with nanoparticles is one of the ways to solve problems with the removal of bacteria, whereby improving the biological, chemical and technological stability of process fluids. In the article, we monitor the effects of doping process fluids with nanoparticles of silica (SiO2), titanium dioxide (TiO2), silver nitrate (AgNO3) and ascorbic acid (C6H8O6) on the friction coefficient and on the wear of friction pairs of Si3N4 balls against steel 16MnCr5, EN 10084-94. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/1742-6596/709/1/012001

Additional details

Publishing Information

Journal Title
Journal of Physics. Conference Series (Online)
Journal Volume
709
Journal Issue
1
Journal Page Range
[10 p.]
ISSN
1742-6596

Conference

Title
International conference on microtechnology and thermal problems in electronics; SENM'2015: International conference on smart engineering of new materials
Acronym
MicroTherm'2015
Dates
22-25 Jun 2015
Place
Lodz (Poland)