Nanoscale CuO Solid-electrolyte-based Conductive-bridging, Random-access Memory Cell with a TiN Liner

The Conductive-bridge random-access memory (CBRAM) cell is a promising candidate for a terabit-level non-volatile memory due to its remarkable advantages. We present for the first time TiN as a diffusion barrier in CBRAM cells for enhancing their reliability. CuO solid-electrolytebased CBRAM cells implemented with a 0.1-nm TiN liner demonstrated better non-volatile memory characteristics such as ∼ 106 AC write/erase endurance cycles with 100-μs AC pulse width and a long retention time of ∼ 7.4-years at 85 ◦C. In addition, the analysis of Ag diffusion in the CBRAM cell suggests that the morphology of the Ag filaments in the electrolyte can be effectively controlled by tuning the thickness of the TiN liner. These promising results pave the way for faster commercialization of terabit-level non-volatile memories.