Published June 15, 2008
| Version v1
Journal article
Three-point bending fracture characteristics of three-dimensional-C/SiC with single-edge notch beam specimens
- 1. Laboratory for High-Temperature Structural Composite Materials, Northwest Polytechnic University, Xi'an 710072 (China)
- 2. Department of Materials Science and Engineering, Jiujiang University, Jiujiang 332005 (China)
- 3. Department of Materials Science and Engineering, Xi'an University of Science and Technology, Xi'an 710054 (China)
Description
Loading-unloading properties of three-dimensional-C/SiC composites at ambient temperature were studied by three-point bending experiments with single-edge notch beam specimens. Crack growth was examined by scanning electron microscopy. The whole propagation process of a notch consists of a transient state and a steady state. The crack growth resistance is derived based on energy evaluation by a graphical method taking into account the non-linear fracture of the composites. The maximum value of the crack growth resistance, corresponding to the transition of the notch into cracks, reaches about 303.7 kJ m-2 when the ratio of equivalent crack length to sample thickness amounts to 0.13. The energy for the steady crack growth is about 20 kJ m-2
Availability note (English)
Available from http://dx.doi.org/10.1016/j.msea.2006.09.187Additional details
Identifiers
- DOI
- 10.1016/j.msea.2006.09.187;
- PII
- S0921-5093(07)00953-7;
Publishing Information
- Journal Title
- Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
- Journal Volume
- 483-484
- Journal Page Range
- p. 123-126
- ISSN
- 0921-5093
- CODEN
- MSAPE3
Conference
- Title
- 14. international conference on the strength of materials
- Dates
- 4-9 Jun 2006
- Place
- Xian (China)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 40025479
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- AMBIENT TEMPERATURE; BENDING; CARBON; CRACK PROPAGATION; CRACKS; EVALUATION; FRACTURES; NOTCHES; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDES
- Descriptors DEC
- CARBIDES; CARBON COMPOUNDS; DEFORMATION; ELECTRON MICROSCOPY; ELEMENTS; FAILURES; MICROSCOPY; NONMETALS; SILICON COMPOUNDS
Optional Information
- Copyright
- Copyright (c) 2007 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.