Published November 2001 | Version v1
Journal article

Study on stability of a-SiCOF films deposited by plasma enhanced chemical vapor deposition

  • 1. Fudan Univ., Shanghai (China). Dept. of Electronic Engineering

Description

Low-dielectric-constant a-SiCOF films have been prepared from TEOS, C4F8 and Ar by using plasma enhanced chemical vapor deposition method. With the aid of X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared spectroscopy (FTIR), the chemical bonding configuration, thermal stability and resistance to water of the films are explored

Additional details

Publishing Information

Journal Title
High Technology Letters
Journal Volume
11
Journal Issue
11
Journal Page Range
p. 5-8
ISSN
1002-0470