Fabrication and adhesion performance of gold conductive patterns on silicon substrate by laser sintering

Laser sintering of gold-microparticle ink was examined in this study. Laser-sintered gold conductive patterns were characterized by using scanning electron microscope (SEM), energy-dispersive spectrometer (EDS), cross-cut tape test and destructive bond wire pull tests. The effects of laser power on microstructure and adhesion of gold conductive patterns were investigated. It was found that the microstructure of gold conductive patterns became denser with increase of laser power. The gold conductive patterns treated with laser power of 2 W showed poor adhesiveness of 2B in accordance with ASTM D3359-08. The adhesion level of gold conductive patterns increased to 5B by elevating laser power to 8 W. The adhesion mechanism of gold conductive patterns on silicon substrate was discussed and wire bonding test was also performed on gold conductive patterns. Wire breakage took place at the practical pull strength of around 5 gf.