Published June 2010 | Version v1
Journal article

Stick-slip behavior of serrated flow during inhomogeneous deformation of bulk metallic glasses

  • 1. Laboratory of Metal Physics and Technology, Department of Materials, ETH Zurich, Wolfgang-Pauli-Strasse 10, 8093 Zurich (Switzerland)

Description

Accurate compression tests with a piezoelectric load cell and an acquisition rate of up to 10 kHz were performed on a Zr-based bulk metallic glass in the temperature range 210-320 K at a strain rate of 10-3 s-1. Information about the stress drop magnitude and the associated size of shear displacements as a function of temperature and strain provides detailed insights into the shear band characteristics, which can be described by a stick-slip process. The average shear slip displacement is on average about 1-2 μm, irrespective of temperature, whereas the associated slip time (or stress drop time) increases from ∼1 ms at 320 K to ∼0.4 s at 213 K, yielding values on the deformation kinetics and the shear viscosity. Scanning electron microscopy investigations on shear surfaces and in situ acoustic emission measurements provide further understanding into the complex multistep shear slip process.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.actamat.2010.03.011

Additional details

Identifiers

DOI
10.1016/j.actamat.2010.03.011;
PII
S1359-6454(10)00156-4;

Publishing Information

Journal Title
Acta Materialia
Journal Volume
58
Journal Issue
10
Journal Page Range
p. 3742-3750
ISSN
1359-6454
CODEN
ACMAFD

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
43039086
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
COMPLEXES; COMPRESSION; DEFORMATION; EMISSION; KINETICS; METALLIC GLASSES; PIEZOELECTRICITY; SCANNING ELECTRON MICROSCOPY; SHEAR; SLIP; STRAIN RATE; STRAINS; STRESSES; SURFACES; TEMPERATURE DEPENDENCE; TEMPERATURE RANGE; VISCOSITY
Descriptors DEC
ELECTRICITY; ELECTRON MICROSCOPY; MICROSCOPY

Optional Information

Copyright
Copyright (c) 2010 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.