Stick-slip behavior of serrated flow during inhomogeneous deformation of bulk metallic glasses
- 1. Laboratory of Metal Physics and Technology, Department of Materials, ETH Zurich, Wolfgang-Pauli-Strasse 10, 8093 Zurich (Switzerland)
Description
Accurate compression tests with a piezoelectric load cell and an acquisition rate of up to 10 kHz were performed on a Zr-based bulk metallic glass in the temperature range 210-320 K at a strain rate of 10-3 s-1. Information about the stress drop magnitude and the associated size of shear displacements as a function of temperature and strain provides detailed insights into the shear band characteristics, which can be described by a stick-slip process. The average shear slip displacement is on average about 1-2 μm, irrespective of temperature, whereas the associated slip time (or stress drop time) increases from ∼1 ms at 320 K to ∼0.4 s at 213 K, yielding values on the deformation kinetics and the shear viscosity. Scanning electron microscopy investigations on shear surfaces and in situ acoustic emission measurements provide further understanding into the complex multistep shear slip process.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.actamat.2010.03.011Additional details
Identifiers
- DOI
- 10.1016/j.actamat.2010.03.011;
- PII
- S1359-6454(10)00156-4;
Publishing Information
- Journal Title
- Acta Materialia
- Journal Volume
- 58
- Journal Issue
- 10
- Journal Page Range
- p. 3742-3750
- ISSN
- 1359-6454
- CODEN
- ACMAFD
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 43039086
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- COMPLEXES; COMPRESSION; DEFORMATION; EMISSION; KINETICS; METALLIC GLASSES; PIEZOELECTRICITY; SCANNING ELECTRON MICROSCOPY; SHEAR; SLIP; STRAIN RATE; STRAINS; STRESSES; SURFACES; TEMPERATURE DEPENDENCE; TEMPERATURE RANGE; VISCOSITY
- Descriptors DEC
- ELECTRICITY; ELECTRON MICROSCOPY; MICROSCOPY
Optional Information
- Copyright
- Copyright (c) 2010 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.