Published 1998 | Version v1
Book

Fracture strength of DS-Cu/316SS HIP bonded structure

  • 1. Kawasaki Heavy Industry, Higashi-kawasaki-cho, Chuuou-ku, Kobe-shi (Japan)
  • 2. Tsukuba Univ. (Japan)
  • 3. Japan Atomic Energy Research Inst., Tokyo (Japan)

Description

HIP bonded structure of Al2O3 dispersion copper (DS-Cu) and Type 316 stainless steel has been proposed for ITER shielding blanket. In this study fracture toughness test and fatigue crack growth test were performed in order to estimate fracture strength of HIP bonded structure. It is found that fracture toughness of HIP bonded structure depends on HIP temperature and is about 60% of fracture toughness of DS-Cu base metal. It is also found that the crack growth rate along HIP bonded interface is four times higher than that in DS-Cu base metal. (author)

Part of:
Fusion technology 1998

Additional details

Publishing Information

Publisher
Association Euratom-CEA Cadarache
Imprint Place
Saint-Paul-Lez-Durance (France)
Imprint Title
Fusion technology 1998
Imprint Pagination
(v.1-2) 1744 p.
Journal Page Range
p. 177-180

Conference

Title
20. symposium on fusion technology
Dates
7-11 Sep 1998
Place
Marseille (France)

Optional Information