Published November 14, 2006 | Version v1
Journal article

Bulk micromachining of silicon using electron-beam-induced carbonaceous nanomasking

  • 1. Laboratoire MADIREL (UMR 6121), Electrochemistry of Materials Group, Universite de Provence-CNRS Centre Saint Jerome, F-13397 Marseille Cedex 20 (France)
  • 2. Institut de Recherche Interdisciplinaire (IRI), Avenue Poincare BP 60069, 59652 Villeneuve d'Ascq (France)
  • 3. Department of Materials Science, University of Erlangen-Nuremberg, WW4-LKO, Martensstrasse 7, D-91058 Erlangen (Germany)

Description

This paper reports on an alternative nanolithographic technique for bulk micromachining of silicon. We show how to selectively etch Si(110) in aqueous KOH solutions using electron-beam-induced nanomasking. Already nanometre thin carbonaceous films can completely suppress the wet anisotropic chemical etching of Si performed in alkaline solution (10 wt% KOH+5 wt% isopropanol). It is shown that under optimized conditions, this approach can be exploited for the fabrication of three-dimensional micro- and nanostructures

Availability note (English)

Available online at http://stacks.iop.org/0957-4484/17/5363/nano6_21_013.pdf or at the Web site for the journal Nanotechnology (Print) (ISSN 1361-6528 ) http://www.iop.org/

Additional details

Publishing Information

Journal Title
Nanotechnology (Print)
Journal Volume
17
Journal Issue
21
Journal Page Range
p. 5363-5366
ISSN
0957-4484