Role of bimodal distribution in tailoring the inter-particle interactions in Cu79Co21 nanogranular films
- 1. Thin Film Laboratory, Indian Institute of Technology Delhi, New Delhi-110016 (India)
Description
Nanogranular Cu79Co21 films were deposited by magnetron co-sputtering and their magnetotransport properties were investigated as a function of thickness (t). The fitting of magnetoresistance (MR) data reveals the presence of bimodal distribution of Co-particles. With the increase of film thickness from 25 to 200 nm, whereas smaller particle (2.5 nm) distribution remains unaffected, the bigger one grows monotonically from 3.3 nm to 4.9 nm for 25 ≤ t < 100 nm and stays same (4.9 nm) for 100 ≤ t ≤ 200 nm. From MR data recorded in the range of 20–300 K, it is observed that dependence of MR on thickness keeps on reducing on lowering the temperature. This observance has been presented in terms of presence of bimodal distribution and its role in tailoring the inter-particle magnetic interactions
Additional details
Identifiers
- DOI
- 10.1063/1.4873026;
Publishing Information
- Journal Title
- AIP Conference Proceedings
- Journal Volume
- 1591
- Journal Issue
- 1
- Journal Page Range
- p. 1541-1543
- ISSN
- 0094-243X
- CODEN
- APCPCS
Conference
- Title
- 58. DAE solid state physics symposium 2013
- Dates
- 17-21 Dec 2013
- Place
- Patiala, Punjab (India)
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 45090589
- Subject category
- S36: MATERIALS SCIENCE; S77: NANOSCIENCE AND NANOTECHNOLOGY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- DEPOSITS; DISTRIBUTION; FILMS; MAGNETORESISTANCE; MAGNETRONS; NANOSTRUCTURES; PARTICLE INTERACTIONS; PARTICLES; SPUTTERING; THICKNESS
- Descriptors DEC
- DIMENSIONS; ELECTRIC CONDUCTIVITY; ELECTRICAL PROPERTIES; ELECTRON TUBES; ELECTRONIC EQUIPMENT; EQUIPMENT; INTERACTIONS; MICROWAVE EQUIPMENT; MICROWAVE TUBES; PHYSICAL PROPERTIES
Optional Information
- Notes
- (c) 2014 AIP Publishing LLC