Published October 2004 | Version v1
Journal article

Investigation of mechanical behavior of copper in Nb3Sn superconducting composite wire

Description

The mechanical properties and the thermal residual stress distribution of copper in Nb3Sn/Cu composite superconductor were investigated in detail. The stabilizer copper was removed from the composite wire, and the stress-strain behavior of this wire was compared with that of the original composite wire. The subtraction yielded the stress-strain curves of the copper when the Bauschinger effect was taken into account. The tensile test of the composites from which about 30% and 60% of copper was removed suggested the existence of the distribution of the thermal residual stress in the stabilizer copper. When this factor was taken into account, the analytical stress-strain curve agreed well with the experimental stress-strain curve. Thus, the stress-stain behavior of each component was fully understood

Additional details

Identifiers

DOI
10.1016/j.physc.2004.02.218;
PII
S0921453404008858;

Publishing Information

Journal Title
Physica. C, Superconductivity
Journal Volume
412-414
Journal Issue
1-2
Journal Page Range
p. 1261-1266
ISSN
0921-4534
CODEN
PHYCE6

Conference

Title
16. International symposium on superconductivity: Advances in superconductivity XVI. Part I
Acronym
ISS 2003
Dates
27-29 Oct 2003
Place
Tsukuba (Japan)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
36062042
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Resource subtype / Literary indicator
Conference
Descriptors DEI
COPPER; DEFORMATION; DISTRIBUTION; INTERMETALLIC COMPOUNDS; NIOBIUM; RESIDUAL STRESSES; STRAINS; SUPERCONDUCTING COMPOSITES; SUPERCONDUCTING WIRES; SUPERCONDUCTORS; TENSILE PROPERTIES; TIN
Descriptors DEC
ALLOYS; COMPOSITE MATERIALS; ELEMENTS; MATERIALS; MECHANICAL PROPERTIES; METALS; REFRACTORY METALS; STRESSES; TRANSITION ELEMENTS; WIRES

Optional Information

Copyright
Copyright (c) 2004 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.