Investigation of mechanical behavior of copper in Nb3Sn superconducting composite wire
Description
The mechanical properties and the thermal residual stress distribution of copper in Nb3Sn/Cu composite superconductor were investigated in detail. The stabilizer copper was removed from the composite wire, and the stress-strain behavior of this wire was compared with that of the original composite wire. The subtraction yielded the stress-strain curves of the copper when the Bauschinger effect was taken into account. The tensile test of the composites from which about 30% and 60% of copper was removed suggested the existence of the distribution of the thermal residual stress in the stabilizer copper. When this factor was taken into account, the analytical stress-strain curve agreed well with the experimental stress-strain curve. Thus, the stress-stain behavior of each component was fully understood
Additional details
Identifiers
- DOI
- 10.1016/j.physc.2004.02.218;
- PII
- S0921453404008858;
Publishing Information
- Journal Title
- Physica. C, Superconductivity
- Journal Volume
- 412-414
- Journal Issue
- 1-2
- Journal Page Range
- p. 1261-1266
- ISSN
- 0921-4534
- CODEN
- PHYCE6
Conference
- Title
- 16. International symposium on superconductivity: Advances in superconductivity XVI. Part I
- Acronym
- ISS 2003
- Dates
- 27-29 Oct 2003
- Place
- Tsukuba (Japan)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 36062042
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- COPPER; DEFORMATION; DISTRIBUTION; INTERMETALLIC COMPOUNDS; NIOBIUM; RESIDUAL STRESSES; STRAINS; SUPERCONDUCTING COMPOSITES; SUPERCONDUCTING WIRES; SUPERCONDUCTORS; TENSILE PROPERTIES; TIN
- Descriptors DEC
- ALLOYS; COMPOSITE MATERIALS; ELEMENTS; MATERIALS; MECHANICAL PROPERTIES; METALS; REFRACTORY METALS; STRESSES; TRANSITION ELEMENTS; WIRES
Optional Information
- Copyright
- Copyright (c) 2004 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.