Published July 29, 2015 | Version v1
Journal article

The potential link between high angle grain boundary morphology and grain boundary deformation in a nickel-based superalloy

  • 1. Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 44321 (United States)
  • 2. Center for Accelerated Maturation of Materials, The Ohio State University, Columbus, OH 44321 (United States)
  • 3. Air Force Research Laboratory, Materials & Manufacturing Directorate, AFRL/RXCM, Wright-Patterson AFB, Dayton, OH 45433 (United States)

Description

Focused ion beam (FIB) based serial sectioning was utilized to characterize the morphology of two high angle grain boundaries (HAGB) in a nickel based superalloy, one that experienced grain boundary sliding (GBS) and the other experienced strain accumulation, during elevated temperature constant stress loading conditions. A custom script was utilized to serial section and collect ion-induced secondary electron images from the FIB-SEM system. The MATLAB based MIPARTM software was utilized to align, segment and reconstruct 3D volumes from the sectioned images. Analysis of the 3D data indicates that the HAGB that exhibited GBS had microscale curvature that was planar in nature, and local serrations on the order of ±150 nm. In contrast, the HAGB that exhibited strain accumulation was not planar and had local serrations an order of magnitude greater than the other grain boundary. It is hypothesized that the serrations and the local grain boundary network are key factors in determining which grain boundaries experience GBS during creep deformation

Availability note (English)

Available from http://dx.doi.org/10.1016/j.msea.2015.05.031

Additional details

Identifiers

DOI
10.1016/j.msea.2015.05.031;
PII
S0921-5093(15)00553-5;

Publishing Information

Journal Title
Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
Journal Volume
640
Journal Page Range
p. 280-286
ISSN
0921-5093
CODEN
MSAPE3

Optional Information

Copyright
Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.