The effects of H2 addition on the enhanced deposition rate and high quality Cu films by MOCVD

High-quality Cu thin films were deposited on the TiN/Si substrate from the hexafluoroacetylacetonate Copper thrmethylvinylsilane [Cu (hfac) (tmvs)] source using a metal organic chemical vapor deposition (MOCVD) technique. The optimum deposition condition is with a substrate temperature of 200 .deg. C and the hydrogen flow rate of 80 sccm. The deposition rate, electrical resistivity, surface morphology, grain size, and optical properties of the deposited Cu films were investigated by the AES, four-point probe, SEM, XRD, and the visible spectrophotometer as a function of hydrogen gas flow rate, The results indicated that additional hydrogen gas affects the CVD hydrogen reduction reaction improving the purity, deposition rate, and electrical resistivity of Cu thin films. A prospective idea will be discussed for the preparation of Cu thin films showing a more enhanced electromigration resistance applicable to the next-generation interconnection