Physical deposition of thin polyimide layers by applying an argon plasma assisted process

A novel method for physical deposition of thin polyimide layers by applying an argon plasma assisted process has been developed. The influence of the plasma on the combined molecular flux of the two thermally evaporated precursors - 4,4'- oxydianiline and pyromellitic dianhydride was investigated. The process parameters were changed in the limlts 0,4 - 2 A for the anode current and 80 - 170 V for the anode voltage. Their influence was studied using FTIR spectroscopy and electron microscopy techniques. It was proposed that the plasma flux crossing the molecular flows of the polyimide precursors enhances the imidization process by partly activating the precursor molecules in the gas phase.