Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification
Creators
- 1. School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China)
- 2. School of Materials Science and Engineering, Nanchang University, Nanchang 330031 (China)
- 3. China Electronics Technology Group Corporation No. 38 Research Institute, Hefei 230088 (China)
Description
Highlights: • The Sn0.7Cu–xBi solder alloys were directionally solidified. • Both spacing and diameter of fibers decreased with increasing solidification rate. • The UTS and YS first increased with increased solidification rate, then decreased. • The UTS and YS of Sn0.7Cu–xBi first increased with increased Bi content. - Abstract: Bi-containing Sn0.7Cu (SC) eutectic solder alloys were prepared and subjected to directional solidification, through which new types of fiber reinforced eutectic composites were generated. The influences of Bi addition on the microstructures and tensile properties of directionally solidified (DS) Bi-containing eutectic SC lead-free solder alloys have been investigated by using differential scanning calorimetry (DSC), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and a tensile testing machine. The experimental results showed that addition of Bi could effectively reduce both the melting temperature and undercooling of SC solder alloy. The microstructures of DS SC–xBi solder alloys were composed of Sn-rich phase (β) and Cu6Sn5 fiber. No other intermetallic compounds (IMCs) with Bi content were observed in the solder matrix for SC solder alloys with various Bi contents. Both fiber spacing and diameter all decreased gradually with increasing growth rate and/or Bi content. Besides, the regularity of Cu6Sn5 fibers alignment also decreased with increasing growth rate, too. The tensile strengths of the SC–xBi eutectic solder alloys varied parabolically with growth rate (R). When R was 60 μm/s, maximum tensile strengths of 43.8, 55.2 and 56.37 MPa were reached for SC, SC0.7Bi and SC1.3Bi solder alloys. A comparison of tensile strength of SC, SC0.7Bi and SC1.3Bi with the same R indicated that the tensile strength increased with increasing Bi content, which was attributed to the presence of Bi and its role in refining microstructure and solid solution strengthening
Availability note (English)
Available from http://dx.doi.org/10.1016/j.jallcom.2014.10.205Additional details
Identifiers
- DOI
- 10.1016/j.jallcom.2014.10.205;
- PII
- S0925-8388(14)02720-0;
Publishing Information
- Journal Title
- Journal of Alloys and Compounds
- Journal Volume
- 625
- Journal Page Range
- p. 241-250
- ISSN
- 0925-8388
- CODEN
- JALCEU
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 47011994
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ALIGNMENT; BISMUTH ADDITIONS; CALORIMETRY; COMPARATIVE EVALUATIONS; COPPER ALLOYS; EUTECTICS; FIBERS; INTERMETALLIC COMPOUNDS; MELTING POINTS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLID SOLUTIONS; SOLIDIFICATION; SPECTROSCOPY; TENSILE PROPERTIES; TIN ALLOYS
- Descriptors DEC
- ALLOYS; BISMUTH ALLOYS; DISPERSIONS; ELECTRON MICROSCOPY; EVALUATION; HOMOGENEOUS MIXTURES; MECHANICAL PROPERTIES; MICROSCOPY; MIXTURES; PHASE TRANSFORMATIONS; PHYSICAL PROPERTIES; SOLUTIONS; THERMODYNAMIC PROPERTIES; TRANSITION ELEMENT ALLOYS; TRANSITION TEMPERATURE
Optional Information
- Copyright
- Copyright (c) 2014 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.