Published 1985
| Version v1
Journal article
Examination of rapid thermal annealing process after ion implantation
- 1. Hitachi Ltd., Kokubunji, Tokyo (Japan). Central Research Lab.
Description
no abstract available
Additional details
Publishing Information
- Journal Title
- Hosei Daigaku Ion Bimu Kagaku Kenkyusho Hokoku
- Journal Issue
- suppl.4
- Series
- Hosei Daigaku Ion Bimu Kagaku Kenkyusho Hokoku.
- ISSN
- 0286-0201
- CODEN
- HDIHD
Conference
- Title
- 3. symposium on ion beam technology, Hosei University. Ion beam analysis.
- Dates
- 7-8 Dec 1984.
- Place
- Koganei, Tokyo (Japan).
INIS
- Country of Publication
- Japan
- Country of Input or Organization
- Japan
- INIS RN
- 17018018
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Resource subtype / Literary indicator
- Conference, Numerical Data, No Abstract
- Descriptors DEI
- ACTIVATION ENERGY; ANNEALING; ARSENIC IONS; BORON IONS; DEPTH; ELECTRIC CONDUCTIVITY; EXPERIMENTAL DATA; FILMS; ION IMPLANTATION; MOS TRANSISTORS; SEMICONDUCTOR JUNCTIONS; TEMPERATURE DEPENDENCE; TIME DEPENDENCE; TUNGSTEN SILICIDES
- Descriptors DEC
- ATOMIC IONS; CHARGED PARTICLES; DATA; DIMENSIONS; ELECTRICAL PROPERTIES; ENERGY; HEAT TREATMENTS; INFORMATION; IONS; NUMERICAL DATA; PHYSICAL PROPERTIES; SEMICONDUCTOR DEVICES; SILICIDES; SILICON COMPOUNDS; TRANSISTORS; TRANSITION ELEMENT COMPOUNDS; TUNGSTEN COMPOUNDS
Optional Information
- Notes
- Published in summary form only.