Wetting and contact interaction of niobium with ternary copper base melts

Under conditions of heating of substrates and samples of the melted phase wetting of niobium with melts of Cu-Al with aluminium content to 10% (weight) as well as with melts of Cu-1% Si-Sn, Cu-1% Ge-Sn, Cu-1% Al-Sn, Cu-1% Ti-Sn with tin content to 5% (weight) is studied. Tests are performed at the temperature of 1370 K in vacuum 6.7x10-4-1.3x10-3 Pa. Distribution of active additions at the solid-liquid interface is studied by the method of X-ray spectrometry. It is shown that wetting ability of the melts decreases in succession: Cu-1% Si-Sn, Cu-1% Ge-Sn, Cu-1% Ti-Sn. Some remarks about interphase activity of the studied additions are reported