Published May 23, 2016 | Version v1
Journal article

Ab-initio study of thermal expansion in pure graphene

  • 1. Department of Physics, Panjab University, Chandigarh-160014 (India)
  • 2. D.A.V. College, Sec-10, Chandigarh-160010 (India)

Description

Graphene is a zero band gap semiconductor with exceptionally high thermal conductivity. The electronic properties having been studied, therole of phonon in contributing to thermal expansion, thermal conductivity and other thermodynamic properties, is required to be investigated. This paper focuses more on thermal expansion. Some others results like phonon dispersion, Grüneisenparameters and bulk modulus,which are essential to estimation of thermal expansion, are also presented. The dynamical matrix was calculated using VASP code using both DFT and DFPT and the phonon frequencies were calculated using phonopy code under harmonic approximation. The linear thermal expansion coefficient of graphene is found to be strongly dependent on temperature but remains negative upto 470 K and positive thereafter, with a room temperature value of −1.44×10−6. The negative expansion coefficient is very interesting and is found to be in conformity with experimental as well as with recent theoretical estimates. There is only qualitative agreement of our results with experimental data and motivates further investigation, primarily on the high negative values of Grüneisen parameters.

Additional details

Identifiers

Publishing Information

Journal Title
AIP Conference Proceedings
Journal Volume
1731
Journal Issue
1
Journal Page Range
vp.
ISSN
0094-243X
CODEN
APCPCS

Conference

Title
DAE solid state physics symposium 2015
Dates
21-25 Dec 2015
Place
Uttar Pradesh (India)

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
48054819
Subject category
S77: NANOSCIENCE AND NANOTECHNOLOGY;
Resource subtype / Literary indicator
Conference
Descriptors DEI
APPROXIMATIONS; DENSITY FUNCTIONAL METHOD; DISPERSIONS; GRAPHENE; PHONONS; SEMICONDUCTOR MATERIALS; SIMULATION; TEMPERATURE RANGE 0273-0400 K; THERMAL CONDUCTIVITY; THERMAL EXPANSION
Descriptors DEC
CALCULATION METHODS; CARBON; ELEMENTS; EXPANSION; MATERIALS; NONMETALS; PHYSICAL PROPERTIES; QUASI PARTICLES; TEMPERATURE RANGE; THERMODYNAMIC PROPERTIES; VARIATIONAL METHODS

Optional Information

Notes
(c) 2016 Author(s)