Published January 1, 2014 | Version v1
Journal article

Effects of adding injection–compression to rapid heat cycle molding on the structure of a light guide plate

  • 1. Micro Manufacturing System Technology Center, Korea Institute of Industrial Technology, 1271-18, Sa-3-dong, Sangnok-gu, Ansan-si, Gyeonggi-do 426-910 (Korea, Republic of)
  • 2. Department of Mechanical Engineering, Dankook University, 152, Jukjeon-ro, Suji-gu, Yongin-si, Gyeonggi-do 448-702 (Korea, Republic of)

Description

This study investigates the effects of adding injection–compression to rapid heat cycle molding (RHCM) (rapid heat cycle injection–compression molding (RICM)) on the physical quality and optical anisotropy of a molded light guide plate (LGP). Transcription ratio of microstructure, uniformity of part thickness and birefringence were experimentally evaluated on a 7 inch LGP of nominal thickness of 1.12 mm (including a microstructure array of 30 µm diameter and 14 µm height). The designed mold was equipped with rapid heating and compressing facilities and a microstructured nickel stamper was fabricated by UV LIGA process. In addition, to investigate the efficacy of RICM, experiments involving conventional injection molding (CIM), ICM, and RHCM were conducted in parallel with RICM using the same mold. RHCM and RICM yielded excellent transcription ratios for the microstructure, while CIM and RICM provided high thickness uniformity and low birefringence. Thus, RICM obtains high transcription ratio of microstructure, uniform thickness and low birefringence. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/0960-1317/24/1/015009

Additional details

Publishing Information

Journal Title
Journal of Micromechanics and Microengineering. Structures, Devices and Systems
Journal Volume
24
Journal Issue
1
Journal Page Range
[15 p.]
ISSN
0960-1317
CODEN
JMMIEZ

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
47057916
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Descriptors DEI
ANISOTROPY; BIREFRINGENCE; HEAT; HEATING; HEIGHT; INJECTION; MICROSTRUCTURE; MOLDING; NICKEL; OPTICAL FIBERS; PLATES; THICKNESS; TRANSCRIPTION
Descriptors DEC
DIMENSIONS; ELEMENTS; ENERGY; FABRICATION; FIBERS; INTAKE; METALS; REFRACTION; TRANSITION ELEMENTS