Effects of adding injection–compression to rapid heat cycle molding on the structure of a light guide plate
- 1. Micro Manufacturing System Technology Center, Korea Institute of Industrial Technology, 1271-18, Sa-3-dong, Sangnok-gu, Ansan-si, Gyeonggi-do 426-910 (Korea, Republic of)
- 2. Department of Mechanical Engineering, Dankook University, 152, Jukjeon-ro, Suji-gu, Yongin-si, Gyeonggi-do 448-702 (Korea, Republic of)
Description
This study investigates the effects of adding injection–compression to rapid heat cycle molding (RHCM) (rapid heat cycle injection–compression molding (RICM)) on the physical quality and optical anisotropy of a molded light guide plate (LGP). Transcription ratio of microstructure, uniformity of part thickness and birefringence were experimentally evaluated on a 7 inch LGP of nominal thickness of 1.12 mm (including a microstructure array of 30 µm diameter and 14 µm height). The designed mold was equipped with rapid heating and compressing facilities and a microstructured nickel stamper was fabricated by UV LIGA process. In addition, to investigate the efficacy of RICM, experiments involving conventional injection molding (CIM), ICM, and RHCM were conducted in parallel with RICM using the same mold. RHCM and RICM yielded excellent transcription ratios for the microstructure, while CIM and RICM provided high thickness uniformity and low birefringence. Thus, RICM obtains high transcription ratio of microstructure, uniform thickness and low birefringence. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/0960-1317/24/1/015009Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Micromechanics and Microengineering. Structures, Devices and Systems
- Journal Volume
- 24
- Journal Issue
- 1
- Journal Page Range
- [15 p.]
- ISSN
- 0960-1317
- CODEN
- JMMIEZ
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 47057916
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- ANISOTROPY; BIREFRINGENCE; HEAT; HEATING; HEIGHT; INJECTION; MICROSTRUCTURE; MOLDING; NICKEL; OPTICAL FIBERS; PLATES; THICKNESS; TRANSCRIPTION
- Descriptors DEC
- DIMENSIONS; ELEMENTS; ENERGY; FABRICATION; FIBERS; INTAKE; METALS; REFRACTION; TRANSITION ELEMENTS