Published May 15, 2013 | Version v1
Journal article

Transient photocurrents as a spatially resolved probe of carrier transport and defect distributions in silicon thin films

  • 1. School of Engineering, Physics and Mathematics, University of Dundee, Nethergate, Dundee DD1 4HN, Scotland (United Kingdom)
  • 2. Carl von Ossietzsky Universität Oldenburg, Institut für Physik, D-26111 Oldenburg, Federal Republic of Germany (Germany)
  • 3. Institut für Energie- und Klimaforschung (IEK-5 Photovoltaik), Forschungszentrum Jülich, Leo Brandt Strasse, D-52425 Jülich, Federal Republic of Germany (Germany)

Description

Highlights: ► Transient photocurrents were measured in amorphous and microcrystalline silicon. ► The electronic density of states was calculated from photocurrent transients. ► A computer model confirmed depth-dependence with laser pulse wavelength. ► In amorphous silicon light-soaking modifies the electronic defect profile. ► In microcrystalline silicon a seed layer modifies growth correlated to defect density. -- Abstract: Transient photocurrent spectroscopy (TPC) yields the energetic distribution of localised states in disordered semiconductors from an analysis of the decay of photocurrent with time following a short laser pulse. By comparing results at different laser excitation wavelengths, and hence absorption depths, information on spatial non-uniformities may also be inferred. Here we investigate the use of TPC as a spatial probe with reference to two thin-film silicon systems; amorphous silicon subjected to various light-induced degradation regimes, and microcrystalline silicon grown on a range of 'seed' layers. Computer simulation is used to support experimental findings, and to identify sensitivity and resolution limitations

Availability note (English)

Available from http://dx.doi.org/10.1016/j.mseb.2012.10.040

Additional details

Identifiers

DOI
10.1016/j.mseb.2012.10.040;
PII
S0921-5107(12)00546-6;

Publishing Information

Journal Title
Materials Science and Engineering. B, Solid-State Materials for Advanced Technology
Journal Volume
178
Journal Issue
9
Journal Page Range
p. 568-573
ISSN
0921-5107
CODEN
MSBTEK

Optional Information

Copyright
Copyright (c) 2012 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.