Heat load test of Be/Cu joint for ITER first wall mock-ups

Bonding by hot isostatic pressing with an interlayer has been developed as a joining technology of beryllium (Be)/alumina dispersion strengthened copper, a candidate for the ITER first wall. Heat removal and thermal cycle tests with a heat flux of 5 MW/m2 for 1000 cycles were carried out to evaluate the heat removal performance and the durability of these joints for two types of mock-up that were fabricated with an interlayer of either Al/Ti/Cu or pure Cu. These tests were carried out at OHBIS (Oarai Hot-cell electron Beam Irradiation System) in JAERI. Both mock-ups showed good heat removal performance at conditions simulating the ITER-FEAT operation. It became clear that the interlayer of Al/Ti/Cu excelled pure Cu from the point of cracking at the interface