Published September 2009 | Version v1
Miscellaneous Open

Low temperature formation of platinum silicide for Schottky diodes contact layer

  • 1. A.N. Sevchenko scientific-research inst. of applied physics, Minsk (Belarus)
  • 2. UF 'Transistor', Minsk (Belarus)

Description

In the given work structural and electrophysical properties of contact layers of platinum silicides formed on silicon wafers by deposition of thin platinum layers and low temperature annealing (100-280 C) were investigated. It is shown, that process of silicide formation in Pt/Si system begins at temperatures of about 160 C. During heat treatment at 160-260 C only Pt2Si phase is revealed. There is no any influence of Si wafer doping on process of silicide formation. Thin layers of silicides, generated at lower temperatures (< 280 C), are more perfect in depth, and also are characterized by more homogeneous grain sizes. (authors)

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Part of:
Interaction of radiation with solids. Proceedings of 8. International conference

Additional details

Additional titles

Original title (Russian)
Особенности низкотемпературного формирования силицида платины для контактных слоев силовых диодов шоттки

Publishing Information

Imprint Place
Minsk (Belarus)
ISBN
978-985-476-728-4
Imprint Title
Interaction of radiation with solids. Proceedings of 8. International conference
Imprint Pagination
365 p.
Journal Page Range
p. 338-339
Report number
INIS-BY--089

Conference

Title
8. International conference 'Interaction of radiation with solids'
Original Conference Title
8. Mezhdunarodnaya konferentsiya 'Vzaimodejstvie izluchenij s tverdym telom'
Dates
23-25 Sep 2009
Place
Minsk (Belarus)

Optional Information

Notes
2 refs., 3 figs. Imprint:Vzaimodejstvie izluchenij s tverdym telom. Materialy 8. Mezhdunarodnoj konferentsii