Published January 1, 2012 | Version v1
Journal article

Optical, morphological, structural, electrical, molecular orientation, and electroluminescence characteristics of organic semiconductor films prepared at various deposition rates

  • 1. School of Materials Science, Japan Advanced Institute of Science and Technology, 1–1 Asahidai, Nomi, Ishikawa 923-1292 (Japan)
  • 2. Graduate School of Science and Engineering, University of Toyama, 3190 Gofuku, Toyama 930-8555 (Japan)

Description

Extremely high deposition rates of ≈ 7200 nm s−1 for N,N′-diphenyl-N,N′-bis(1-naphthyl)-1,1′-biphenyl-4,4′-diamine (α-NPD) and of ≈ 1700 nm s−1 for tris(8-hydroxyquinoline)aluminum (Alq3) are found to be possible by controlling source–substrate distances and crucible temperatures. Shapes of ultraviolet–visible absorption spectra and photoluminescence (PL) spectra, atomic force microscope images, X-ray diffraction patterns, PL quantum yields, PL lifetimes, and PL radiative decay rates of the films remain independent of the deposition rates ranging from 0.01 to 1000 nm s−1. On the other hand, hole currents of hole-only α-NPD devices increase ≈ 3 times while electron currents of electron-only Alq3 devices decrease by ≈ 1/60 as the deposition rates are increased from 0.01 to 10 nm s−1. The increase in hole current is confirmed to arise from an increase in hole mobility of α-NPD measured using a time-of-flight technique. The increase in hole mobility is probably due to a parallel orientation of an electronic transition moment of α-NPD at the higher deposition rates. Moreover, the three orders of magnitude increase in deposition rate from 0.01 to 10 nm s−1 of α-NPD and Alq3 results in a relatively small increase in voltage of ≈ 15% and a decrease in external quantum efficiency of ≈ 30% in organic light-emitting diodes (OLEDs). The reduction of the OLED performance is attributable to the marked decrease in electron current relative to the slight increase in hole current, indicating a decrease in charge balance factor at the higher deposition rates.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2011.09.060

Additional details

Identifiers

DOI
10.1016/j.tsf.2011.09.060;
PII
S0040-6090(11)01708-1;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
520
Journal Issue
6
Journal Page Range
p. 2283-2288
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2011 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.