Published May 2, 2011
| Version v1
Journal article
Ion-implanted resist removal using atomic hydrogen
- 1. Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka 567-0047 (Japan)
- 2. Kanazawa Institute of Technology, 3-1 Yatsukaho, Hakusan, Ishikawa 924-0838 (Japan)
- 3. Daipla wintes, 1-3-26 Nagasunishidori, Amagasaki, Hyougo 660-0807 (Japan)
Description
We removed B-, P-, and As-ion-implanted positive-tone novolak resists with an implantation dose of 5 x 1012 to 5 x 1015 atoms/cm2 at 70 keV, using atomic hydrogen. Though the removal rate decreased with increase in the implantation dose, all of the ion-implanted resists were removed. The rates of thickness of the surface-hardened layer/all resist layer of B, P, and As implanted resists were 0.38, 0.26, and 0.16, respectively, by SEM observation. The removal rate decreased with increasing the rate of the surface-hardened layer. The energy supplied from the ions to the resist concentrated on the surface side in the increasing order of B-P-As.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.tsf.2011.01.287Additional details
Identifiers
- DOI
- 10.1016/j.tsf.2011.01.287;
- PII
- S0040-6090(11)00352-X;
Publishing Information
- Journal Title
- Thin Solid Films
- Journal Volume
- 519
- Journal Issue
- 14
- Journal Page Range
- p. 4578-4581
- ISSN
- 0040-6090
- CODEN
- THSFAP
Conference
- Title
- 6. international conference on hot-wire CVD (Cat-CVD) process
- Dates
- 13-17 Sep 2010
- Place
- Palaiseau (France)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 43050204
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ARSENIC IONS; ATOMS; AUGMENTATION; DOSES; HYDROGEN; ION IMPLANTATION; LAYERS; REMOVAL; SCANNING ELECTRON MICROSCOPY; SURFACES; THICKNESS
- Descriptors DEC
- CHARGED PARTICLES; DIMENSIONS; ELECTRON MICROSCOPY; ELEMENTS; IONS; MICROSCOPY; NONMETALS
Optional Information
- Copyright
- Copyright (c) 2011 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.