Published June 1975
| Version v1
Journal article
Non-destructive testing of electronic component packages
Description
A non-destructive method of investigating packaged parts of semiconductor components by X radiation is described and the relevant theoretical relations limiting this technique are derived. The application of the technique is demonstrated in testing several components. The described method is iNsimple and quick. (author)
Additional details
Publishing Information
- Journal Title
- Tesla Electron., Q. Rev. Czech. Electron. Telecommun.
- Journal Volume
- 8
- Journal Issue
- 2
- Series
- Tesla Electron., Q. Rev. Czech. Electron. Telecommun.
- Journal Page Range
- 35-39
INIS
- Country of Publication
- Serbia and Montenegro
- Country of Input or Organization
- Serbia and Montenegro
- INIS RN
- 7240711
- Subject category
- S42: ENGINEERING; S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY;
- Descriptors DEI
- INTEGRATED CIRCUITS; PACKAGING; SEMICONDUCTOR DIODES; TRANSISTORS; X-RAY RADIOGRAPHY
- Descriptors DEC
- ELECTRONIC CIRCUITS; INDUSTRIAL RADIOGRAPHY; MATERIALS TESTING; NONDESTRUCTIVE TESTING; SEMICONDUCTOR DEVICES; TESTING