Published August 8, 2005 | Version v1
Journal article

Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures

  • 1. Materials Science Division, Argonne National Laboratory, Argonne, Illinois 60434 (United States)
  • 2. Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208 (United States)

Description

There have been long-standing concerns about the stability of the internal structure of nanocrystalline metals. In this letter we examine grain growth in nanocrystalline Cu under the microhardness indenter, examining the influence of temperature of indentation and sample purity. Surprisingly, it is found that grain coarsening is even faster at cryogenic temperatures than at room temperature. Sample purity is seen to play an important role in determining the rate of grain growth. Fast grain coarsening can affect the outcome of mechanical tests, especially if they involve large stresses and high-purity samples

Additional details

Identifiers

Publishing Information

Journal Title
Applied Physics Letters
Journal Volume
87
Journal Issue
6
Journal Page Range
p. 061921-061921.3
ISSN
0003-6951
CODEN
APPLAB

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
37017671
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
COPPER; CRYOGENICS; CRYSTALS; GRAIN GROWTH; IMPURITIES; MECHANICAL TESTS; MICROHARDNESS; NANOSTRUCTURES; STRESSES; TEMPERATURE DEPENDENCE; TEMPERATURE RANGE 0065-0273 K; TEMPERATURE RANGE 0273-0400 K
Descriptors DEC
ELEMENTS; HARDNESS; MATERIALS TESTING; MECHANICAL PROPERTIES; METALS; TEMPERATURE RANGE; TESTING; TRANSITION ELEMENTS

Optional Information

Notes
(c) 2005 American Institute of Physics