Published August 8, 2005
| Version v1
Journal article
Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures
- 1. Materials Science Division, Argonne National Laboratory, Argonne, Illinois 60434 (United States)
- 2. Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208 (United States)
Description
There have been long-standing concerns about the stability of the internal structure of nanocrystalline metals. In this letter we examine grain growth in nanocrystalline Cu under the microhardness indenter, examining the influence of temperature of indentation and sample purity. Surprisingly, it is found that grain coarsening is even faster at cryogenic temperatures than at room temperature. Sample purity is seen to play an important role in determining the rate of grain growth. Fast grain coarsening can affect the outcome of mechanical tests, especially if they involve large stresses and high-purity samples
Additional details
Identifiers
- DOI
- 10.1063/1.2008377;
Publishing Information
- Journal Title
- Applied Physics Letters
- Journal Volume
- 87
- Journal Issue
- 6
- Journal Page Range
- p. 061921-061921.3
- ISSN
- 0003-6951
- CODEN
- APPLAB
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 37017671
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- COPPER; CRYOGENICS; CRYSTALS; GRAIN GROWTH; IMPURITIES; MECHANICAL TESTS; MICROHARDNESS; NANOSTRUCTURES; STRESSES; TEMPERATURE DEPENDENCE; TEMPERATURE RANGE 0065-0273 K; TEMPERATURE RANGE 0273-0400 K
- Descriptors DEC
- ELEMENTS; HARDNESS; MATERIALS TESTING; MECHANICAL PROPERTIES; METALS; TEMPERATURE RANGE; TESTING; TRANSITION ELEMENTS
Optional Information
- Notes
- (c) 2005 American Institute of Physics