Published November 30, 2011 | Version v1
Miscellaneous Open

Characterization Of Lead Glass For Capture X-Ray Images

  • 1. Pusat Rekayasa Perangkat Nuklir, Kawasan PUSPIPTEK Serpong, Gedung 71, Tangerang Selatan, 153100 (Indonesia)

Description

Characterization has been made of lead glass for X-ray image capture. ThLs characterization aims to determine the quality of the lead glass to X-ray absorption and light transmission. X-ray machine will be operated at the operating voltage of 60 keV. Theoretical calculations of X-ray absorption is based on the assumption that the dominant composition of lead glass is Si02, PbO, then specify the density (p) and the linear absorption coefficient (µ). While the light transmission is calculated using Light Dependent Resistor (LOR). The results show that the characterization of lead glass with a thickness of 1.7 em is capable of absorbing radiation X-ray light and still be able to continue in accordance with the provisions of SNI 16-656-2002 about lead glass for X-ray protection. The conclusion of this characterization is to meet the standards of lead glass for use in X-ray image capture. (author)

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Part of:
Proceedings of the Scientific Engineering Meeting for Nuclear Devices

Additional details

Additional titles

Original title (Indonesian)
Karakterisasi Kaca Timbal Untuk Penangkap Citra Sinar-X

Publishing Information

Publisher
Center for Nuclear Device Engineering
Imprint Place
Serpong (Indonesia)
Imprint Title
Proceedings of the Scientific Engineering Meeting for Nuclear Devices
Imprint Pagination
378 p.
Journal Page Range
p. 55-62
ISSN
1693-3346
Report number
INIS-ID--109

Conference

Title
Scientific Engineering Meeting for Nuclear Devices
Original Conference Title
Pertemuan Ilmiah Rekayasa Perangkat Nuklir
Dates
30 Nov 2011
Place
Serpong (Indonesia)

INIS

Country of Publication
Indonesia
Country of Input or Organization
Indonesia
INIS RN
54089397
Subject category
S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY;
Resource subtype / Literary indicator
Conference
Descriptors DEI
ABSORPTION; CALCULATION METHODS; CAPTURE; GLASS; IMAGE PROCESSING; LEAD; LIGHT TRANSMISSION; RESISTORS; THICKNESS; X-RAY DETECTION
Descriptors DEC
DETECTION; DIMENSIONS; ELECTRICAL EQUIPMENT; ELEMENTS; EQUIPMENT; METALS; PROCESSING; RADIATION DETECTION; SORPTION; TRANSMISSION

Optional Information

Notes
6 refs.; 7 tabs.; 1 fig. Imprint:Prosiding Pertemuan Ilmiah Rekayasa Perangkat Nuklir