Published October 1, 2009 | Version v1
Journal article

Electroless plating of aluminum using diisobutyl aluminum hydride as liquid reducing agent in room-temperature ionic liquid

  • 1. Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science, 2641, Yamazaki, Noda-shi, Chiba 278-8510 (Japan)

Description

We investigated an electroless aluminum plating based on using AlCl3-1-ethyl-3-methylimidazolium chloride (AlCl3-EMIC) ionic liquid with diisobutyl aluminum hydride (DIBAH) as a liquid reducing agent. The plating film was analyzed by measurements of X-ray diffraction, scanning electron microscopy with energy-dispersive X-ray analysis (SEM-EDX) and glow discharge optical emission spectroscopy (GD-OES). Consequently, a thick aluminum plating film with high uniformity was prepared from AlCl3-EMIC with DIBAH. No impurity phases were detected. Moreover, we discussed the reaction mechanism of the electroless aluminum plating.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.electacta.2009.05.052

Additional details

Identifiers

DOI
10.1016/j.electacta.2009.05.052;
PII
S0013-4686(09)00737-3;

Publishing Information

Journal Title
Electrochimica Acta
Journal Volume
54
Journal Issue
24
Journal Page Range
p. 5889-5893
ISSN
0013-4686
CODEN
ELCAAV

Optional Information

Copyright
Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.