Published 2007 | Version v1
Journal article

3D active edge silicon sensor testbeam studies

  • 1. Physikalisches Inst., Univ. Bonn (Germany)
  • 2. Brunel Univ., Uxbridge (United Kingdom)
  • 3. Univ. of Hawaii, Honolulu, HI (United States)
  • 4. Lawrence Berkeley Lab., Berkeley (United States)
  • 5. Univ. of Torino (Italy)

Description

At a particle flux of 1015 neqcm-2, as will be already reached for the innermost layers of the LHC detectors, current silicon sensors reach the limits of their radiation hardness. At sLHC the radiation dose will increase by at least one order of magnitude. At these doses it becomes impossible to fully deplete the sensors. Since only the depleted part contributes to signal generation, the devices seize to operate. One possible solution are 3D detectors. Here the collecting diodes are not on top of the detector, but are grown into the bulk. This results in short electrodes that are at very small distances. Therefore, the depletion voltage becomes very low, allowing full depletion even at very high fluences, and the charge collection becomes very fast, while still taking advantage of the full 300 μm thickness of the silicon. 3D detectors with different electrode topologies were operated in a high energy particle beam at CERN. (orig.)

Availability note (English)

Also available online at: http://www.dpg-tagungen.de/index_en.html

Additional details

Publishing Information

Journal Title
Verhandlungen der Deutschen Physikalischen Gesellschaft
Journal Volume
42
Journal Issue
1
Journal Page Range
[1 p.]
ISSN
0420-0195
CODEN
VDPEAZ

Conference

Title
DPG Spring meeting 2007 with the sections of gravitation and relativity theory, particle physics, theoretical and mathematical fundamentals of physics
Original Conference Title
DPG-Fruehjahrstagung 2007 der Fachverbaende Gravitation und Relativitaetstheorie,Teilchenphysik, Theoretische und Mathematische Grundlagen der Physik
Dates
5-9 Mar 2007
Place
Heidelberg (Germany)

INIS

Optional Information

Notes
Session: T 214.6 Di 18:05. No further information available