Total dose effects on the matching properties of deep submicron MOS transistors
- 1. Science and Technology on Analog Integrated Circuit Laboratory, Chongqing 400060 (China)
- 2. No. 24 Research Institute, China Electronics Technology Group Corporation, Chongqing 400060 (China)
- 3. Xinjiang Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Urumqi 830011 (China)
Description
Based on 0.18 μm MOS transistors, for the first time, the total dose effects on the matching properties of deep submicron MOS transistors are studied. The experimental results show that the total dose radiation magnifies the mismatch among identically designed MOS transistors. In our experiments, as the radiation total dose rises to 200 krad, the threshold voltage and drain current mismatch percentages of NMOS transistors increase from 0.55% and 1.4% before radiation to 17.4% and 13.5% after radiation, respectively. PMOS transistors seem to be resistant to radiation damage. For all the range of radiation total dose, the threshold voltage and drain current mismatch percentages of PMOS transistors keep under 0.5% and 2.72%, respectively. (semiconductor devices)
Availability note (English)
Available from http://dx.doi.org/10.1088/1674-4926/35/6/064007Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Semiconductors
- Journal Volume
- 35
- Journal Issue
- 6
- Journal Page Range
- [5 p.]
- ISSN
- 1674-4926
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 47018691
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- DESIGN; ELECTRIC POTENTIAL; MOS TRANSISTORS; RADIATION DOSES; RADIATION EFFECTS
- Descriptors DEC
- DOSES; SEMICONDUCTOR DEVICES; TRANSISTORS