Published June 1, 2014 | Version v1
Journal article

Total dose effects on the matching properties of deep submicron MOS transistors

  • 1. Science and Technology on Analog Integrated Circuit Laboratory, Chongqing 400060 (China)
  • 2. No. 24 Research Institute, China Electronics Technology Group Corporation, Chongqing 400060 (China)
  • 3. Xinjiang Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Urumqi 830011 (China)

Description

Based on 0.18 μm MOS transistors, for the first time, the total dose effects on the matching properties of deep submicron MOS transistors are studied. The experimental results show that the total dose radiation magnifies the mismatch among identically designed MOS transistors. In our experiments, as the radiation total dose rises to 200 krad, the threshold voltage and drain current mismatch percentages of NMOS transistors increase from 0.55% and 1.4% before radiation to 17.4% and 13.5% after radiation, respectively. PMOS transistors seem to be resistant to radiation damage. For all the range of radiation total dose, the threshold voltage and drain current mismatch percentages of PMOS transistors keep under 0.5% and 2.72%, respectively. (semiconductor devices)

Availability note (English)

Available from http://dx.doi.org/10.1088/1674-4926/35/6/064007

Additional details

Publishing Information

Journal Title
Journal of Semiconductors
Journal Volume
35
Journal Issue
6
Journal Page Range
[5 p.]
ISSN
1674-4926

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
47018691
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
DESIGN; ELECTRIC POTENTIAL; MOS TRANSISTORS; RADIATION DOSES; RADIATION EFFECTS
Descriptors DEC
DOSES; SEMICONDUCTOR DEVICES; TRANSISTORS