Evaluation of fracture toughness of copper thin films by combining numerical analyses and experimental tests
Creators
- 1. Seoul National Universtiy of Science and Technology, Seoul (Korea, Republic of)
- 2. Ulsan College, Ulsan (Korea, Republic of)
- 3. Korea Institute of Materials Science, Changwon (Korea, Republic of)
- 4. Korea Institute of Machinery and Materials, Daejeon (Korea, Republic of)
Description
In this paper, a method of combining numerical analyses and experimental tests is used to evaluate fracture toughness of copper thin films of 15μm thickness. Far field loadings of a global local finite element model are inversely estimated by matching crack opening profiles in experiments with numerical results. The fracture toughness is then evaluated using the J integral for cracks in thin films under far field loadings. In experiments, Cu thin films attached to Aluminum sheets are loaded indirectly, and crack opening profiles are observed by microscope camera. Stress versus strain curves of Cu thin films are obtained through micro tensile tests, and the grain size of Cu thin films is observed by TEM analysis. The results show that the fracture toughness of Cu thin films with 500nm∼1μm sized grains is 6,962J/m'2'
Additional details
Publishing Information
- Journal Title
- Transactions of the Korean Society of Mechanical Engineers. A
- Journal Volume
- 37
- Journal Issue
- 2
- Series
- 15 refs, 11 figs, 2 tabs
- Journal Page Range
- p. 233-239
- ISSN
- 1226-4873
INIS
- Country of Publication
- Korea, Republic of
- Country of Input or Organization
- Korea, Republic of
- INIS RN
- 44064541
- Subject category
- S42: ENGINEERING;
- Descriptors DEI
- ALUMINIUM; CAMERAS; COPPER; CRACKS; FINITE ELEMENT METHOD; FRACTURE PROPERTIES; NUMERICAL ANALYSIS; TENSILE PROPERTIES; THICKNESS; THIN FILMS
- Descriptors DEC
- CALCULATION METHODS; DIMENSIONS; ELEMENTS; FILMS; MATHEMATICAL SOLUTIONS; MATHEMATICS; MECHANICAL PROPERTIES; METALS; NUMERICAL SOLUTION; TRANSITION ELEMENTS