Fracture characterization of inhomogeneous wrinkled metallic films deposited on soft substrates
- 1. Department of Precision Mechanics, Chuo University, 1-13-27 Kasuga, Bunkyo, Tokyo, 112-8551 (Japan)
Description
This study investigated the fracture properties of wrinkled metallic films on a polydimethylsiloxane (PDMS) soft substrate. In particular, the crack density of the wrinkled film during tensile deformation was examined. In order to achieve better deformability of metallic thin films, a method to fabricate a wrinkled thin film on a PDMS soft substrate was first established. The copper (Cu) nano-film fabricated in this study possessed a wrinkled geometry, which plays a critical role in determining the extent of large elastic deformation. To create the wrinkled structure, wet-etching with a polymeric sacrificial layer was used. A sacrificial layer was first deposited onto a silicone rubber sheet. During the curing process of the layer, a compressive strain was applied such that the hardened surface layer buckled, and a wrinkled form was obtained. Subsequently, a PDMS solution was used to cover the layer in order to form a wrinkled PDMS substrate. Finally, the Cu film was deposited onto the wrinkled PDMS, such that the wrinkled Cu film on a soft PDMS substrate was fabricated. The use of uni-axial tensile tests resulted in film crack generation at the stress concentration zone in the wrinkled structure of the films. When the tensile loading was increased, the number of cracks increased. It was found that the increase in crack density was strongly related to the inhomogeneous nature of the wrinkled structure. Such a trend in crack density was investigated using FEM (finite element method) computations, such that this study established a simple mechanical model that may be used to predict the increase in crack density during tensile deformation. This model was verified through several experiments using various wrinkle patterns. The proposed mechanical model may be useful to predict the crack density of a wrinkled metallic film subject to tensile loading. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/1361-6463/aa95cbAdditional details
Identifiers
Publishing Information
- Journal Title
- Journal of Physics. D, Applied Physics
- Journal Volume
- 50
- Journal Issue
- 49
- Journal Page Range
- [11 p.]
- ISSN
- 0022-3727
- CODEN
- JPAPBE
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 52077019
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- COPPER; CRACKS; ELASTICITY; ETCHING; FINITE ELEMENT METHOD; FRACTURE PROPERTIES; FRACTURES; LAYERS; RUBBERS; SILICONES; SUBSTRATES; THIN FILMS
- Descriptors DEC
- CALCULATION METHODS; ELASTOMERS; ELEMENTS; FAILURES; FILMS; MATHEMATICAL SOLUTIONS; MECHANICAL PROPERTIES; METALS; NUMERICAL SOLUTION; ORGANIC COMPOUNDS; ORGANIC POLYMERS; ORGANIC SILICON COMPOUNDS; POLYMERS; SILOXANES; SURFACE FINISHING; TRANSITION ELEMENTS