Published April 13, 2011 | Version v1
Journal article Metadata-only

Effect of ultrasonic energy on nanoscale interfacial structure in copper wire bonding on aluminium pads

Creators

  • 1. Department of Metallurgical and Materials Engineering, University of Alabama, Tuscaloosa, Alabama 35487 (United States)
  • 2. Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, LE11 3TU (United Kingdom)
  • 3. School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798 (Singapore)

Description

The effect of ultrasonic vibration on nanoscale interfacial structure of thermosonic copper wire bonding on aluminium pads was investigated. It was found that bonding strength was determined by the extent of fragmentation of a native aluminium oxide overlayer (5-10 nm thick) on aluminium pads, forming paths for formation of intermetallic compound CuAl2 in areas of direct contact of bonded metal surfaces. The degree of fracture of the oxide layer was strongly affected by a level of ultrasonic power.

Availability note (English)

Available from http://dx.doi.org/10.1088/0022-3727/44/14/145301

Additional details

Identifiers

DOI
10.1088/0022-3727/44/14/145301;
PII
S0022-3727(11)72325-7;

Publishing Information

Journal Title
Journal of Physics. D, Applied Physics
Journal Volume
44
Journal Issue
14
Journal Page Range
[5 p.]
ISSN
0022-3727
CODEN
JPAPBE

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
43033916
Subject category
S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
Descriptors DEI
ALUMINIUM; ALUMINIUM OXIDES; BONDING; COPPER; FRACTURES; FRAGMENTATION; INTERMETALLIC COMPOUNDS; LAYERS; NANOSTRUCTURES; SURFACES
Descriptors DEC
ALLOYS; ALUMINIUM COMPOUNDS; CHALCOGENIDES; ELEMENTS; FABRICATION; FAILURES; JOINING; METALS; OXIDES; OXYGEN COMPOUNDS; TRANSITION ELEMENTS